In the next five years, global 5G deployment and data center applications are expected to grow exponentially [1]. This drives the demand for high-performance optical communication devices , making it one of the most important foundations. Specifically, these key components support the shipment of 5G wireless fronthaul and next-generation Ethernet modules, including 2x200GbE, 4x 100G bE and 400GbE, and CWDM/ DWDM transceivers [2]. The major market growth of this type of new high-performance optical devices has triggered new placement requirements, including smaller package housings, higher packaging densities, smaller chip sizes, faster technology innovation and product iterations, and larger output demand and more economical price. The same need exists for lidar, AR/VR, advanced photonic sensors, MEMS, and even highly integrated silicon photonic devices.
During the manufacture of these devices, one of the biggest challenges is how to successfully deploy a flexible chip placement solution to meet the needs of high-volume flexible production while maintaining high post-placement accuracy and machine performance. Good long-term stability [3]. Historically, each generation of photonic devices has precision requirements after placement, from 15-20 microns to 7-10 microns, and then to 5-7 microns. The latest generation of high-performance photonic devices requires post-attach accuracy of less than 3 microns without sacrificing high throughput or high flexibility to enable a high mix of product types in high-volume production. Conventional high-yield semiconductor devices may have high precision and speed, but do not have the flexibility required for photonic devices. There are also pick and place machines specifically designed for photonics manufacturing that offer accuracy, flexibility, or speed, but not all of these requirements at the same time. Here, what we introduce is the industry’s first verification in the mass production environment, and at the same time, the high-speed and high-spiritual placement machine platform MRSI-HVM achieves 3 micron or better placement accuracy on the placement machine platform, which can be used in large quantities. High-mix photonic manufacturing.
Challenges of High-Volume High-Mix Photonic Manufacturing
Figure 1 Development trend and assembly tolerance of optical devices
Figure 1 illustrates the development trend of optical devices , and the accompanying device assembly tolerances. The new generation of optical devices requires smaller assembly tolerances and higher post-mounting accuracy, thus requiring higher-precision placement machines. The accuracy after placement depends not only on the accuracy of the machine, but also on the tolerances of chips and substrates, and the stability of the process. The tolerance limit of the general assembly is very limited. The higher the machine accuracy and process stability, the more tolerance can be left for the material, and the higher the yield of the packaging process will be. In order to achieve the accuracy of <±3 microns after placement, the chip mounter needs to have a stable machine accuracy of <±1.5 microns. This <±1.5 micron@3σ machine accuracy, coupled with high speed and high flexibility, is a huge challenge for chip mounter suppliers.
An added challenge is the need for smaller and higher density components that reduce the power consumption of optics. For high-density devices requiring a eutectic process, special high-precision top heating tools need to be provided to prevent secondary reflow of adjacent chips during the eutectic process. This high-precision pulsed heating technique is very useful in high-density optical devices, but it brings more challenges to the chip mounter. In addition, unlike silicon-based electrical chips, photonic chips are usually very fragile, and the bonding force of the patch soldering head needs to be precisely controlled, which is also very critical.
Figure 2 compares the disruptive new cloud-based data center business model with the traditional telecom-centric business model. [4] In this comparison, the requirements of the new cloud-based data center model include a large manufacturing base that can meet the order scale, while the capacity can be increased immediately, and a cost-sensitive price. This means that new cloud-based data center business models require a high-volume production that we call “elasticity.” In the 5G era, 5G fronthaul is similar to the data center model, and 5G backhaul is similar to the telecom model. The long-term trend for 5G optics is that it will be part of a high-growth market with different bandwidth requirements, including the need for different high-speed transceivers. Due to the rapid technological innovation and product iterations in the 5G and data center markets, volume manufacturers need to be more flexible than in the past. This poses new challenges for photonic device suppliers.
Figure 2 Comparison of the new cloud-based data center model with the traditional telecom-centric model
MRSI－HVM Solution
MRSI’s MRSI-HVM achieves an accuracy of <±3 microns after bonding at an industry-leading speed with a high level of flexible chip placement process and long-term machine stability (see Figure 3). The machine is designed to provide the latest flexible mass-production manufacturing solutions for the optoelectronics industry. In order to achieve the accuracy after placement of <±3 microns@3σ, the chip placement machine itself should have a pick-and-place accuracy of <±1.5×m@3σ. The design of the machine is equipped with double placement heads and double eutectic tables, which can realize the synchronous switching of suction heads and tools “on the fly”, and can realize high-speed batch manufacturing suitable for different chip placement processes on the same equipment. In addition, this solution can also be used as a chip placement unit to support different types of chip placement processes in the optical device flexible manufacturing system, as well as a wiring system connected with other manufacturing units to realize an artificial intelligence factory.
Figure 3 MRSI-HVM 1.5 micron high-speed, high-flexibility placement machine
MRSI-HVM application test results
MRSI-HVM is currently the only flexible high-speed placement machine that can achieve <±1.5 microns@3σ. Dozens of them have been installed around the world with excellent results. It provides the best high-mix and high-volume manufacturing solution for manufacturing 5G and data center core devices.
MRSI verified the accuracy of the MRSI-HVM machine with industry standard glass chips. The pick-and-place accuracy test of 100 glass chips was carried out on the left head and the right head respectively to verify the machine accuracy of the two heads. Fig. 4 shows the distribution results of pick-and-place accuracies of the left (M1) and right (M2) heads of MRSI-HVM glass chips, and both heads satisfy the accuracy of <±1 micron @ 3σ. For the configuration with heater on the right side, the MRSI-HVM platform can also obtain the same level of test results.
On the customer’s production line, MRSI’s solutions achieve <±3 micron post-patch accuracy at industry-leading speeds. Figure 5 below shows 500 production data for a typical chip-to-carrier AuSn eutectic process. The results show that MRSI-HVM can achieve high precision after patching X<±3 micron@3σ, Y<±3×m micron@3σ, angle<0.5°@3σ. The post-mount accuracy data results show a post-mount accuracy of less than ±3 microns. The pick-and-place accuracy of the glass chip in the epoxy dipping process is the same, and the offset after curing depends on the process design of each customer. If the process of in-situ UV curing epoxy glue is used, the precision after curing can also be less than 3 microns.
The UPH of the MRSI-HVM machine can reach up to 1800 (varies with different applications), and the machine has been running on site 24 hours a day in production.
Fig. 4 Accuracy distribution results of pick-and-place positions of glass chips on the left (M1) and right (M2) heads of the machine (dimension unit: mm)
Figure 5 MRSI-HVM 500 CoC mass production data measurement results (dimension unit: mm)
summary
In summary, manufacturers of high-performance optical communication devices face major challenges driven by the demands of 5G and data center applications. High-volume, high-mix production requires packaging equipment that can simultaneously meet high precision, high output, high flexibility and high stability. Our field application results show that MRSI’s innovative automation solutions and MRSI-HVM series machines can answer these challenges. Our system can meet the manufacturing requirements of “elastic” mass production of optical devices, and achieve the goal of <±3 microns after placement in the production environment.
MRSI Systems
MRSI Systems, a subsidiary of Mycronic Group, is a leading manufacturer of fully automatic, high-speed, high-precision, flexible and multi-functional placement systems. We provide “R&D” for lasers, detectors, modulators , AOC, WDM/EML TO-Can, optical transceivers, LiDAR, VR/AR, sensors and optical imaging products, small to medium batch production, up to mass production One-stop” solution. With more than 30 years of industry experience and our local technical support teams around the world, we provide the most efficient system and assembly solutions for all levels of packaging, including chip on wafer (CoW), chip on substrate (CoC), PCB and box encapsulation. For more information, visit the MRSI Systems official website.
Mycronic
Mycronic is a Swedish high-tech company that develops, manufactures and sells production equipment that meets the high precision and flexibility requirements of the electronics industry. Mycronic is headquartered in Taby, north of Stockholm, and the group has subsidiaries in China, France, Germany, Japan, Singapore, South Korea, the Netherlands, the UK and the US. Mycronic (MYCR) is listed on Nasdaq Stockholm.
Figure 1 Development trend and assembly tolerance of optical devices
Figure 1 illustrates the development trend of optical devices , and the accompanying device assembly tolerances. The new generation of optical devices requires smaller assembly tolerances and higher post-mounting accuracy, thus requiring higher-precision placement machines. The accuracy after placement depends not only on the accuracy of the machine, but also on the tolerances of chips and substrates, and the stability of the process. The tolerance limit of the general assembly is very limited. The higher the machine accuracy and process stability, the more tolerance can be left for the material, and the higher the yield of the packaging process will be. In order to achieve the accuracy of <±3 microns after placement, the chip mounter needs to have a stable machine accuracy of <±1.5 microns. This <±1.5 micron@3σ machine accuracy, coupled with high speed and high flexibility, is a huge challenge for chip mounter suppliers.
An added challenge is the need for smaller and higher density components that reduce the power consumption of optics. For high-density devices requiring a eutectic process, special high-precision top heating tools need to be provided to prevent secondary reflow of adjacent chips during the eutectic process. This high-precision pulsed heating technique is very useful in high-density optical devices, but it brings more challenges to the chip mounter. In addition, unlike silicon-based electrical chips, photonic chips are usually very fragile, and the bonding force of the patch soldering head needs to be precisely controlled, which is also very critical.
Figure 2 compares the disruptive new cloud-based data center business model with the traditional telecom-centric business model. [4] In this comparison, the requirements of the new cloud-based data center model include a large manufacturing base that can meet the order scale, while the capacity can be increased immediately, and a cost-sensitive price. This means that new cloud-based data center business models require a high-volume production that we call “elasticity.” In the 5G era, 5G fronthaul is similar to the data center model, and 5G backhaul is similar to the telecom model. The long-term trend for 5G optics is that it will be part of a high-growth market with different bandwidth requirements, including the need for different high-speed transceivers. Due to the rapid technological innovation and product iterations in the 5G and data center markets, volume manufacturers need to be more flexible than in the past. This poses new challenges for photonic device suppliers.
Figure 2 Comparison of the new cloud-based data center model with the traditional telecom-centric model
MRSI－HVM Solution
MRSI’s MRSI-HVM achieves an accuracy of <±3 microns after bonding at an industry-leading speed with a high level of flexible chip placement process and long-term machine stability (see Figure 3). The machine is designed to provide the latest flexible mass-production manufacturing solutions for the optoelectronics industry. In order to achieve the accuracy after placement of <±3 microns@3σ, the chip placement machine itself should have a pick-and-place accuracy of <±1.5×m@3σ. The design of the machine is equipped with double placement heads and double eutectic tables, which can realize the synchronous switching of suction heads and tools “on the fly”, and can realize high-speed batch manufacturing suitable for different chip placement processes on the same equipment. In addition, this solution can also be used as a chip placement unit to support different types of chip placement processes in the optical device flexible manufacturing system, as well as a wiring system connected with other manufacturing units to realize an artificial intelligence factory.
Figure 3 MRSI-HVM 1.5 micron high-speed, high-flexibility placement machine
MRSI-HVM application test results
MRSI-HVM is currently the only flexible high-speed placement machine that can achieve <±1.5 microns@3σ. Dozens of them have been installed around the world with excellent results. It provides the best high-mix and high-volume manufacturing solution for manufacturing 5G and data center core devices.
MRSI verified the accuracy of the MRSI-HVM machine with industry standard glass chips. The pick-and-place accuracy test of 100 glass chips was carried out on the left head and the right head respectively to verify the machine accuracy of the two heads. Fig. 4 shows the distribution results of pick-and-place accuracies of the left (M1) and right (M2) heads of MRSI-HVM glass chips, and both heads satisfy the accuracy of <±1 micron @ 3σ. For the configuration with heater on the right side, the MRSI-HVM platform can also obtain the same level of test results.
On the customer’s production line, MRSI’s solutions achieve <±3 micron post-patch accuracy at industry-leading speeds. Figure 5 below shows 500 production data for a typical chip-to-carrier AuSn eutectic process. The results show that MRSI-HVM can achieve high precision after patching X<±3 micron@3σ, Y<±3×m micron@3σ, angle<0.5°@3σ. The post-mount accuracy data results show a post-mount accuracy of less than ±3 microns. The pick-and-place accuracy of the glass chip in the epoxy dipping process is the same, and the offset after curing depends on the process design of each customer. If the process of in-situ UV curing epoxy glue is used, the precision after curing can also be less than 3 microns.
The UPH of the MRSI-HVM machine can reach up to 1800 (varies with different applications), and the machine has been running on site 24 hours a day in production.
Fig. 4 Accuracy distribution results of pick-and-place positions of glass chips on the left (M1) and right (M2) heads of the machine (dimension unit: mm)
Figure 5 MRSI-HVM 500 CoC mass production data measurement results (dimension unit: mm)
summary
In summary, manufacturers of high-performance optical communication devices face major challenges driven by the demands of 5G and data center applications. High-volume, high-mix production requires packaging equipment that can simultaneously meet high precision, high output, high flexibility and high stability. Our field application results show that MRSI’s innovative automation solutions and MRSI-HVM series machines can answer these challenges. Our system can meet the manufacturing requirements of “elastic” mass production of optical devices, and achieve the goal of <±3 microns after placement in the production environment.
MRSI Systems
MRSI Systems, a subsidiary of Mycronic Group, is a leading manufacturer of fully automatic, high-speed, high-precision, flexible and multi-functional placement systems. We provide “R&D” for lasers, detectors, modulators , AOC, WDM/EML TO-Can, optical transceivers, LiDAR, VR/AR, sensors and optical imaging products, small to medium batch production, up to mass production One-stop” solution. With more than 30 years of industry experience and our local technical support teams around the world, we provide the most efficient system and assembly solutions for all levels of packaging, including chip on wafer (CoW), chip on substrate (CoC), PCB and box encapsulation. For more information, visit the MRSI Systems official website.
Mycronic
Mycronic is a Swedish high-tech company that develops, manufactures and sells production equipment that meets the high precision and flexibility requirements of the electronics industry. Mycronic is headquartered in Taby, north of Stockholm, and the group has subsidiaries in China, France, Germany, Japan, Singapore, South Korea, the Netherlands, the UK and the US. Mycronic (MYCR) is listed on Nasdaq Stockholm.
